HPE Group at PCIM Europe 2025: Driving Innovation in SiC Power Module Thermal Modeling

From May 6 to 8, 2025, HPE Group proudly participated in PCIM Europe in Nuremberg. This international event is widely recognized as the leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management.

During the conference’s dedicated Thermal Modelling session, HPE Group’s Simulation Engineer, Lorenzo Colombini, and Jacopo Ferretti—a PhD student at the University of Bologna—presented their joint research paper titled:
“Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate.”

Research Within the R-PODID Project Framework.

This work was developed within the European R-PODID project (reliable powerdown for industrial drives). The paper introduces a novel CFD-based methodology to estimate junction-to-fluid thermal resistance in silicon carbide (SiC) power modules—an essential factor in improving both thermal management and system reliability.

Advantages, application and opportunities of the Proposed CFD Methodology 

What sets this methodology apart is its ability to deliver highly accurate temperature predictions. These results were validated not only against manufacturer datasheet values but also against real-world test bench measurements. Moreover, this approach allows for robust electro-thermal simulations across various operating conditions and geometric configurations relying only on publically available data.

Thanks to its flexibility and accuracy, the method opens new possibilities for early-stage design and system-level optimization. In particular, it can be applied in sectors such as automotive, motorsport, off-highway vehicles, defense, and marine, where advanced thermal performance is a key priority.

HPE Group’s Ongoing Commitment to Research and Collaboration

HPE Group’s presence at PCIM Europe once again highlights its strong commitment to research and development, cutting-edge simulation technologies, and active partnerships with academic and European research institutions. Undoubtedly, events like PCIM play a vital role in promoting technological innovation and fostering collaboration across the global power electronics community.

For more information about HPE Group’s simulation technologies and contributions to European mobility innovation.

The full research paper will be published in the PCIM 2025 conference proceedings and made available through major academic databases such as IEEE Xplore and Scopus.